Petelin A.L., Straumal B.B., Bokstein B.S., Baretzky B., Straumal A.B., Rodin A.O.
Grain boundary and triple junction wetting transition in the copper–silver system.

Russia / Россия

The microstructure of a two-component Cu–Ag alloys in the two-phase “solid + liquid” area of the respective bulk phase diagram was investigated. A grain boundary (GB) and trople junction (TJ) wetting phase transition proceeds in these systems. The percentage of wetted TJs is always higher than the percentage of wetted GBs. A temperature exists below which no GBs are wetted and a considerable amount of TJs is wetted.